AMAOE AU-4 0.12mm CPU BGA Reballing Stencil for iPhone A13 and A14

Name: AMAOE AU-4 0.12mm CPU BGA Reballing Stencil for iPhone A13 and A14
Brand: AMAOE
SKU: AU-4
Availability: InStock

₹179.00

Brand: AMAOE

Model: AU-4

Availability: In Stock

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Tags: iPhone A13 AMAOE AU-4 BGA

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Product Description

The AMAOE AU-4 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Apple iPhone devices using A13 and A14 processors.

Key Features

Brand: AMAOE
Model: AU-4
Thickness: 0.12mm
Type: CPU BGA reballing stencil
Supported CPU: Apple A13 and A14
Application: iPhone CPU reballing and motherboard repair
Material: Japanese steel sheet, as listed by the seller

The stencil helps technicians align solder balls or solder paste with the matching BGA layout during CPU rework.

Compatibility Note: Confirm the CPU generation and stencil pattern before use to ensure compatibility with the motherboard being repaired.

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📦 Estimated Delivery Time

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✈️ Shipping Time

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🌍 Important Note

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